MSP430FR5988IRGCR
vs
MSP430FR5989IRGC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
24 MHz
|
24 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| JESD-609 Code |
e4
|
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
48
|
48
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| ROM (words) |
98304
|
131072
|
| ROM Programmability |
FLASH
|
FRAM
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
| Date Of Intro |
|
2017-03-11
|
| Boundary Scan |
|
NO
|
| RAM (bytes) |
|
2048
|
|
|
|
Compare MSP430FR5988IRGCR with alternatives
Compare MSP430FR5989IRGC with alternatives