MSP430F5522IRGCT vs MSP430F5526IRGCR feature comparison

MSP430F5522IRGCT Texas Instruments

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MSP430F5526IRGCR Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code QFN QFN
Package Description GREEN, PLASTIC, VQFN-64 GREEN, PLASTIC, VQFN-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Has ADC YES YES
Additional Feature ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ
Address Bus Width
Bit Size 16 16
Boundary Scan YES YES
CPU Family MSP430 MSP430
Clock Frequency-Max 32 MHz 32 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-N64 S-PQCC-N64
JESD-609 Code e4 e4
Length 9 mm 9 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of DMA Channels 3 3
Number of External Interrupts
Number of I/O Lines 47 47
Number of Serial I/Os 4 4
Number of Terminals 64 64
Number of Timers 4 4
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC64,.35SQ,20 LCC64,.35SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 8192 6144
RAM (words) 8 6
ROM (words) 32768 98304
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Speed 25 MHz 25 MHz
Supply Current-Max 11 mA 11 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 9 mm 9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare MSP430F5522IRGCT with alternatives

Compare MSP430F5526IRGCR with alternatives