MSP430F5509IRGCT
vs
MSP430F5309IRGCR
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
QFN
QFN
Package Description
GREEN, PLASTIC, VQFN-64
GREEN, PLASTIC, VQFN-64
Pin Count
64
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Has ADC
YES
YES
Additional Feature
OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
Address Bus Width
Bit Size
16
16
Boundary Scan
YES
YES
CPU Family
MSP430
MSP430
Clock Frequency-Max
32 MHz
32 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQCC-N64
S-PQCC-N64
JESD-609 Code
e4
e4
Length
9 mm
9 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
3
3
Number of External Interrupts
Number of I/O Lines
47
47
Number of Serial I/Os
2
4
Number of Terminals
64
64
Number of Timers
4
18
On Chip Data RAM Width
16
16
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC64,.35SQ,20
LCC64,.35SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
4096
6144
RAM (words)
2048
3072
ROM (words)
24576
24576
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1 mm
Speed
25 MHz
25 MHz
Supply Current-Max
6.5 mA
6.5 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
9 mm
9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare MSP430F5509IRGCT with alternatives
Compare MSP430F5309IRGCR with alternatives