MSP430F5310IRGZ
vs
MSP430F5308IRGZR
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
GREEN, PLASTIC, VQFN-48
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
|
ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
32 MHz
|
32 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N48
|
S-PQCC-N48
|
Length |
7 mm
|
7 mm
|
Number of I/O Lines |
31
|
47
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.4 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
Texas Instruments
|
Boundary Scan |
|
YES
|
CPU Family |
|
MSP430
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
JESD-609 Code |
|
e4
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Number of DMA Channels |
|
3
|
Number of External Interrupts |
|
|
Number of Serial I/Os |
|
4
|
Number of Timers |
|
18
|
On Chip Data RAM Width |
|
16
|
On Chip Program ROM Width |
|
8
|
Package Equivalence Code |
|
LCC48,.27SQ,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
6144
|
RAM (words) |
|
3072
|
ROM (words) |
|
16384
|
Supply Current-Max |
|
6.5 mA
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MSP430F5310IRGZ with alternatives
Compare MSP430F5308IRGZR with alternatives