MSP430F2252TRHATQ1
vs
MSP430F2252TDAQ1
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QCCN, LCC40,.24SQ,20
|
TSSOP, TSSOP38,.32
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
16
|
16
|
| CPU Family |
MSP430
|
MSP430
|
| JESD-30 Code |
S-PQCC-N40
|
R-PDSO-G38
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
40
|
38
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
TSSOP
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
TSSOP38,.32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
512
|
| ROM (words) |
16384
|
16384
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Current-Max |
0.55 mA
|
0.55 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MSP430F2252TRHATQ1 with alternatives
Compare MSP430F2252TDAQ1 with alternatives