MSP430F2003TRSAT
vs
MSP430F2013TRSA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
GREEN, PLASTIC, QFN-16
|
HVQCCN, LCC16,.16SQ,25
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Has ADC |
YES
|
YES
|
Additional Feature |
IT ALSO OPERATES AT 1.8 V AT 6 MHZ
|
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
|
CPU Family |
MSP430
|
MSP430
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e4
|
e4
|
Length |
4 mm
|
4 mm
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
2
|
|
Number of DMA Channels |
|
|
Number of I/O Lines |
10
|
10
|
Number of Serial I/Os |
|
|
Number of Terminals |
16
|
16
|
Number of Timers |
2
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.16SQ,25
|
LCC16,.16SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
128
|
128
|
RAM (words) |
0.125
|
|
ROM (words) |
1024
|
2048
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
16 MHz
|
16 MHz
|
Supply Current-Max |
0.37 mA
|
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.2 V
|
2.2 V
|
Supply Voltage-Nom |
2.2 V
|
2.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MSP430F2003TRSAT with alternatives
Compare MSP430F2013TRSA with alternatives