MSP430C323IFN
vs
MSP430C323IPM
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
LCC
|
QFP
|
Package Description |
QCCJ, LDCC68,1.0SQ
|
LFQFP, QFP64,.47SQ,20
|
Pin Count |
68
|
64
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
Length |
24.2316 mm
|
10 mm
|
Number of I/O Lines |
14
|
14
|
Number of Terminals |
68
|
64
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
LFQFP
|
Package Equivalence Code |
LDCC68,1.0SQ
|
QFP64,.47SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
4.57 mm
|
1.6 mm
|
Speed |
3.3 MHz
|
3.3 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.2316 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MSP430C323IFN with alternatives
Compare MSP430C323IPM with alternatives