MSP1N973C vs MV1N973C-1TR feature comparison

MSP1N973C Microsemi Corporation

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MV1N973C-1TR Microsemi Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-7 DO-7
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Diode Type ZENER DIODE ZENER DIODE
JESD-609 Code e0 e0
Terminal Finish TIN LEAD TIN LEAD
Base Number Matches 1 1
Package Description O-LALF-W2
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.417 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V
Surface Mount NO
Technology ZENER
Terminal Form WIRE
Terminal Position AXIAL
Voltage Tol-Max 2%
Working Test Current 3.8 mA

Compare MSP1N973C with alternatives

Compare MV1N973C-1TR with alternatives