MSP1N5952AGTR vs 1N5952APE3 feature comparison

MSP1N5952AGTR Microsemi Corporation

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1N5952APE3 Microsemi Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-41
Package Description O-LALF-W2
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-204AL
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.19 W
Qualification Status Not Qualified
Reference Standard MIL-19500 MIL-STD-750
Reference Voltage-Nom 130 V 130 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 10% 10%
Working Test Current 2.9 mA 2.9 mA
Base Number Matches 1 1
Dynamic Impedance-Max 450 Ω
Knee Impedance-Max 5000 Ω
Moisture Sensitivity Level 1
Reverse Current-Max 1 µA
Reverse Test Voltage 98.8 V

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