MSP1N5927BGTR vs MV1N5927BP feature comparison

MSP1N5927BGTR Microsemi Corporation

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MV1N5927BP Microsemi Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-41 DO-41
Package Description O-LALF-W2 O-PALF-W2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-204AL
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.19 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 12 V 12 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 20%
Working Test Current 31.2 mA 31.2 mA
Base Number Matches 1 1
Moisture Sensitivity Level 1

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