MSP1N5259B
vs
1N5259BB2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
STMICROELECTRONICS
Part Package Code
DO-7
Package Description
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.417 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
39 V
39 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
3.2 mA
Base Number Matches
1
1
Knee Impedance-Max
800 Ω
Reverse Current-Max
0.1 µA
Voltage Temp Coeff-Max
36.66 mV/°C
Compare MSP1N5259B with alternatives
Compare 1N5259BB2 with alternatives