MSP1N5256BE3 vs MX1N5256B-1 feature comparison

MSP1N5256BE3 Microsemi Corporation

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MX1N5256B-1 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-7 DO-35
Package Description ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-7, 2 PIN O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.417 W 0.48 W
Qualification Status Not Qualified
Reference Voltage-Nom 30 V 30 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 4.2 mA
Base Number Matches 1 1
Pbfree Code No
Additional Feature METALLURGICALLY BONDED
Reference Standard MIL-19500

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