MSP1N5253BE3TR-1 vs 1N5253BRR1 feature comparison

MSP1N5253BE3TR-1 Microsemi Corporation

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1N5253BRR1 Tak Cheong Electronics (Holdings) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code DO-35 DO-204
Package Description ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 25 V 25 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 35 Ω
Peak Reflow Temperature (Cel) 250

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