MSP1N5237C-1E3
vs
1N756C-A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-35
Package Description
O-LALF-W2
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
8.2 V
Surface Mount
NO
Technology
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WIRE
Terminal Position
AXIAL
Voltage Tol-Max
2%
Working Test Current
20 mA
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare MSP1N5237C-1E3 with alternatives
Compare 1N756C-A with alternatives