MSP1N5230A-1
vs
1N5230A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
DIGITRON SEMICONDUCTORS
|
| Part Package Code |
DO-35
|
|
| Package Description |
O-LALF-W2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-204AH
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.48 W
|
|
| Reference Standard |
MIL-19500
|
|
| Reference Voltage-Nom |
4.7 V
|
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Tol-Max |
10%
|
|
| Working Test Current |
20 mA
|
|
| Base Number Matches |
1
|
34
|
|
|
|
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