MSP1N5229BTR vs 1N5229BRL2 feature comparison

MSP1N5229BTR Microsemi Corporation

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1N5229BRL2 Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Part Package Code DO-7
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.417 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 4.3 V 4.3 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 4
Knee Impedance-Max 2000 Ω
Reverse Current-Max 5 µA
Voltage Temp Coeff-Max 2.365 mV/°C

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