MSP1N5225BE3-1 vs MX1N5225B-1TR feature comparison

MSP1N5225BE3-1 Microsemi Corporation

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MX1N5225B-1TR Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-35 DO-35
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3 V 3 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 1
Moisture Sensitivity Level 1

Compare MSP1N5225BE3-1 with alternatives

Compare MX1N5225B-1TR with alternatives