MSP1N4764CURTR
vs
JAN1N3044B-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DO-213AB
|
|
Package Description |
O-LELF-R2
|
DO-41, 2 PIN
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Additional Feature |
HIGH RELIABILITY
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-41
|
JESD-30 Code |
O-LELF-R2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1 W
|
1 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500
|
MIL-19500/115K
|
Reference Voltage-Nom |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Voltage Tol-Max |
2%
|
5%
|
Working Test Current |
2.5 mA
|
2.5 mA
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MSP1N4764CURTR with alternatives
Compare JAN1N3044B-1 with alternatives