MSP1N4739UR
vs
MLL4739
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MOTOROLA INC
|
| Part Package Code |
DO-213AB
|
|
| Package Description |
O-LELF-R2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-213AB
|
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
MIL-19500
|
|
| Reference Voltage-Nom |
9.1 V
|
9.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Voltage Tol-Max |
10%
|
10%
|
| Working Test Current |
28 mA
|
28 mA
|
| Base Number Matches |
1
|
3
|
| Dynamic Impedance-Max |
|
5 Ω
|
|
|
|
Compare MSP1N4739UR with alternatives