MSP1N4734DPTR vs 1N4734DTA2 feature comparison

MSP1N4734DPTR Microsemi Corporation

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1N4734DTA2 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Part Package Code DO-41 DO-41
Package Description O-PALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-41
JESD-30 Code O-PALF-W2 O-LALF-W2
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 5.6 V 5.6 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 1% 1%
Working Test Current 45 mA 45 mA
Base Number Matches 1 3
Manufacturer Package Code CASE 59-03
Additional Feature METALLURGICALLY BONDED
Knee Impedance-Max 600 Ω
Reverse Current-Max 10 µA

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