MSP1N4698-1TR
vs
MSP1N4698/TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DO-35, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICAL BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Forward Voltage-Max (VF)
1.1 V
JEDEC-95 Code
DO-204AH
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.417 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
11 V
11 V
Reverse Current-Max
0.05 µA
Reverse Test Voltage
8.4 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
0.05 mA
0.05 mA
Base Number Matches
2
1
Compare MSP1N4698-1TR with alternatives
Compare MSP1N4698/TR with alternatives