MSP1N3046UR-1TR
vs
1N3046BB3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
STMICROELECTRONICS
Part Package Code
DO-213AB
Package Description
O-LELF-R2
O-MALF-W2
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-13
JESD-30 Code
O-LELF-R2
O-MALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
METAL
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
120 V
120 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Voltage Tol-Max
20%
5%
Working Test Current
2 mA
2 mA
Base Number Matches
1
1
Category CO2 Kg
8.7
Compliance Temperature Grade
Military: -65C to +175C
Knee Impedance-Max
4500 Ω
Reverse Current-Max
5 µA
Voltage Temp Coeff-Max
114 mV/°C
Compare MSP1N3046UR-1TR with alternatives
Compare 1N3046BB3 with alternatives