MSP1N3045UR-1E3TR
vs
CDLL3045
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-213AB
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED, HIGH RELIABILITY
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
110 V
110 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
20%
20%
Working Test Current
2.3 mA
2.3 mA
Base Number Matches
1
3
Factory Lead Time
14 Weeks
Dynamic Impedance-Max
450 Ω
Compare MSP1N3045UR-1E3TR with alternatives
Compare CDLL3045 with alternatives