MSMCGLCE8.5ATR
vs
MXLSMCGLCE8.5AE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-215AB
|
|
| Package Description |
PLASTIC, SMCG, 2 PIN
|
ROHS COMPLIANT, PLASTIC, SMCG, 2 PIN
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
10.4 V
|
10.4 V
|
| Breakdown Voltage-Min |
9.44 V
|
9.44 V
|
| Breakdown Voltage-Nom |
9.92 V
|
9.92 V
|
| Clamping Voltage-Max |
14.4 V
|
14.4 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Min |
100 pF
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-215AB
|
DO-215AB
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-G2
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
5 W
|
5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
IEC-61000-4-2, 4-4, 4-5
|
|
| Rep Pk Reverse Voltage-Max |
8.5 V
|
8.5 V
|
| Reverse Current-Max |
50 µA
|
|
| Reverse Test Voltage |
8.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MSMCGLCE8.5ATR with alternatives
Compare MXLSMCGLCE8.5AE3 with alternatives