MSM832TMB-020 vs EDI8C32128LP55JM feature comparison

MSM832TMB-020 APTA Group Inc

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EDI8C32128LP55JM White Electronic Designs Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer APTA GROUP INC WHITE ELECTRONIC DESIGNS CORP
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T28 S-XQCC-J68
Length 35.56 mm
Memory Density 262144 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1
Number of Terminals 28 68
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 128KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP QCCJ
Package Equivalence Code DIP28,.3 LDCC68,1.0SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 4.3 mm
Standby Current-Max 0.04 A 0.002 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.165 mA 0.6 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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