MSM832TMB-020
vs
EDI8C32128LP55JM
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
APTA GROUP INC
|
WHITE ELECTRONIC DESIGNS CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP28,.3
|
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
55 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-CDIP-T28
|
S-XQCC-J68
|
Length |
35.56 mm
|
|
Memory Density |
262144 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
Memory Width |
8
|
32
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
68
|
Number of Words |
32768 words
|
131072 words
|
Number of Words Code |
32000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
32KX8
|
128KX32
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
Package Code |
DIP
|
QCCJ
|
Package Equivalence Code |
DIP28,.3
|
LDCC68,1.0SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
4.3 mm
|
|
Standby Current-Max |
0.04 A
|
0.002 A
|
Standby Voltage-Min |
4.5 V
|
2 V
|
Supply Current-Max |
0.165 mA
|
0.6 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MSM832TMB-020 with alternatives
Compare EDI8C32128LP55JM with alternatives