MSM832JM-025
vs
MSM832J-025
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
APTA GROUP INC
|
APTA GROUP INC
|
Part Package Code |
QFJ
|
QFJ
|
Package Description |
QCCJ, LDCC32,.5X.6
|
QCCJ, LDCC32,.5X.6
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
25 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-CQCC-J32
|
R-CQCC-J32
|
Length |
14.03 mm
|
14.03 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
32KX8
|
32KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC32,.5X.6
|
LDCC32,.5X.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.04 A
|
0.04 A
|
Standby Voltage-Min |
4.5 V
|
4.5 V
|
Supply Current-Max |
0.165 mA
|
0.165 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.5 mm
|
11.5 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MSM832JM-025 with alternatives
Compare MSM832J-025 with alternatives