MSM8256VL-35/X0252
vs
WS256K8-120CQA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
APTA GROUP INC
|
WHITE ELECTRONIC DESIGNS CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
120 ns
|
JESD-30 Code |
R-CDIP-T32
|
R-CDIP-T32
|
Length |
43.18 mm
|
42.4 mm
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
256KX8
|
256KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B (Modified)
|
|
Seated Height-Max |
11.174 mm
|
5.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Additional Feature |
|
BATTERY BACK-UP OPERATION
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
15.24 mm
|
|
|
|
Compare MSM8256VL-35/X0252 with alternatives
Compare WS256K8-120CQA with alternatives