MSM8128WI-55
vs
AS7C1025-12TI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
APTA GROUP INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFJ
TSOP2
Package Description
QCCN, LCC32,.45X.7
TSOP2, TSOP32,.46
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
12 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CQCC-N32
R-PDSO-G32
JESD-609 Code
e0
e0
Length
17.78 mm
20.95 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
TSOP2
Package Equivalence Code
LCC32,.45X.7
TSOP32,.46
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.414 mm
1.2 mm
Standby Current-Max
0.002 A
0.0005 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.12 mA
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
10.16 mm
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
240
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