MSM8128SXLMC-10 vs EDI88128C100CB feature comparison

MSM8128SXLMC-10 Mosaic Semiconductor Inc

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EDI88128C100CB White Electronic Designs Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Package Description , 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 100 ns 100 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2 V 4.5 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON
Length 40.64 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP32,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883
Seated Height-Max 3.937 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.095 mA
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Compare MSM8128SXLMC-10 with alternatives

Compare EDI88128C100CB with alternatives