MSM56V16161N-75 vs W9816G6JH-7 feature comparison

MSM56V16161N-75 LAPIS Semiconductor Co Ltd

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W9816G6JH-7 Winbond Electronics Corp

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD WINBOND ELECTRONICS CORP
Package Description TSOP2, TSOP2-50
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Date Of Intro 2018-02-08
Access Mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 5.4 ns 5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G50 R-PDSO-G50
Length 20.95 mm 20.95 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 50 50
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Winbond
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MSM56V16161N-75 with alternatives

Compare W9816G6JH-7 with alternatives