MSM51V4100L-10TS-L
vs
MSM51V4100SL-10TS-L
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
LAPIS SEMICONDUCTOR CO LTD
|
| Package Description |
TSOP, TSOP20/26,.36
|
TSSOP, TSSOP20/26,.36
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
100 ns
|
100 ns
|
| I/O Type |
SEPARATE
|
SEPARATE
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
FAST PAGE DRAM
|
FAST PAGE DRAM
|
| Memory Width |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4MX1
|
4MX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
TSSOP
|
| Package Equivalence Code |
TSOP20/26,.36
|
TSSOP20/26,.36
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
1024
|
1024
|
| Reverse Pinout |
YES
|
YES
|
| Self Refresh |
NO
|
YES
|
| Standby Current-Max |
0.00015 A
|
0.00015 A
|
| Supply Current-Max |
0.055 mA
|
0.055 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
|
|
|