MSM51C256A-70JS
vs
AM90CL255-10JCB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
QCCJ, LDCC18,.33X.53
|
QCCJ, LDCC18,.33X.53
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
70 ns
|
100 ns
|
| I/O Type |
SEPARATE
|
SEPARATE
|
| JESD-30 Code |
R-PQCC-J18
|
R-PQCC-J18
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
FAST PAGE DRAM
|
NIBBLE MODE DRAM
|
| Memory Width |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX1
|
256KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC18,.33X.53
|
LDCC18,.33X.53
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
256
|
256
|
| Supply Current-Max |
0.065 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
18
|
| Access Mode |
|
NIBBLE
|
| Additional Feature |
|
RAS ONLY REFRESH
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
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