MSM511001B-70ZS
vs
MCM511001AZ10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
ZIP, ZIP20,.1
ZIP, ZIP20,.1
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.02
Access Time-Max
70 ns
100 ns
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PZIP-T20
R-PZIP-T20
JESD-609 Code
e0
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
NIBBLE MODE DRAM
NIBBLE MODE DRAM
Memory Width
1
1
Number of Terminals
20
20
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX1
1MX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
ZIP
ZIP
Package Equivalence Code
ZIP20,.1
ZIP20,.1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Standby Current-Max
0.001 A
0.001 A
Supply Current-Max
0.08 mA
0.06 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
ZIG-ZAG
ZIG-ZAG
Base Number Matches
2
3
Power Supplies
5 V