MSM5052-XXX
vs
MSM5052-XXX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
OKI ELECTRIC INDUSTRY CO LTD
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
DIE,
|
DIE,
|
| Pin Count |
61
|
61
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
4
|
4
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-XUUC-N61
|
R-XUUC-N61
|
| Number of I/O Lines |
12
|
12
|
| Number of Terminals |
61
|
61
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
MROM
|
MROM
|
| Speed |
0.032 MHz
|
0.032 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
|
|
|