MSM3764-20RS
vs
MB8264-20M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
FUJITSU LTD
Package Description
DIP-16
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Time-Max
200 ns
200 ns
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
1
1
Number of Terminals
16
16
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
128
128
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare MSM3764-20RS with alternatives
Compare MB8264-20M with alternatives