MSK166E
vs
MSK162E
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MS KENNEDY CORP
|
MS KENNEDY CORP
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
QCCN,
|
POWER, HERMETIC SEALED, DIP-8
|
| Pin Count |
18
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00005 µA
|
0.00005 µA
|
| Common-mode Reject Ratio-Nom |
94 dB
|
94 dB
|
| Input Offset Voltage-Max |
30000 µV
|
30000 µV
|
| JESD-30 Code |
R-CQCC-N18
|
S-CDIP-P8
|
| Length |
8.9535 mm
|
13.716 mm
|
| Neg Supply Voltage Limit-Max |
-175 V
|
-175 V
|
| Neg Supply Voltage-Nom (Vsup) |
-150 V
|
-150 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC40,.5SQ,40
|
DIP8,.9
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38534
|
|
| Seated Height-Max |
2.286 mm
|
6.731 mm
|
| Slew Rate-Nom |
40 V/us
|
20 V/us
|
| Supply Voltage Limit-Max |
175 V
|
175 V
|
| Supply Voltage-Nom (Vsup) |
150 V
|
150 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.3025 mm
|
22.86 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MSK166E with alternatives
Compare MSK162E with alternatives