MSCI12390000TS10
vs
MPCI12390000TS10
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
EXXELIA GROUP
|
MICROSPIRE
|
Package Description |
CHIP
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8504.50.80.00
|
8504.50.80.00
|
DC Resistance |
46 Ω
|
46 Ω
|
Inductance-Nom (L) |
390 µH
|
390 µH
|
Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Quality Factor-Min (at L-nom) |
24
|
24
|
Rated Current-Max |
0.023 A
|
0.023 A
|
Reference Standard |
M83446/06
|
|
Self Resonance Frequency |
3.5 MHz
|
3.5 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
NO
|
NO
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
TIN
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Test Frequency |
0.79 MHz
|
0.79 MHz
|
Tolerance |
10%
|
10%
|
Base Number Matches |
3
|
3
|
Case/Size Code |
|
1111
|
Construction |
|
Rectangular
|
Package Height |
|
2.54 mm
|
Package Length |
|
2.8 mm
|
Package Style |
|
SMT
|
Package Width |
|
2.67 mm
|
Packing Method |
|
Tray
|
|
|
|
Compare MSCI12390000TS10 with alternatives
Compare MPCI12390000TS10 with alternatives