MSC8144VT800B
vs
MSC8144EVT1000A
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
29 X 29 MM, LEAD FREE, PLASTIC, FCPBGA-783
|
,
|
Pin Count |
783
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
5A992
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
Barrel Shifter |
NO
|
NO
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
JESD-609 Code |
e2
|
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
783
|
783
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.176 mm
|
3.176 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.97 V
|
0.97 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
2
|
2
|
Bit Size |
|
32
|
Integrated Cache |
|
YES
|
Number of DMA Channels |
|
16
|
Number of Serial I/Os |
|
1
|
Number of Timers |
|
4
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
90 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
BGA783,28X28,40
|
RAM (words) |
|
49152
|
ROM Programmability |
|
FLASH
|
|
|
|
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