MSC8144TVT800B
vs
MSC8144VT1000B
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Barrel Shifter |
NO
|
NO
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
133 MHz
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
783
|
783
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
3.176 mm
|
3.176 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.97 V
|
0.97 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
2
|
|
|
|