MSC23137C-70DS9
vs
KMM531003B-7
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
SIMM, SSIM72
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.02
|
| Access Time-Max |
70 ns
|
70 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PSMA-N72
|
R-XSMA-N72
|
| Memory Density |
37748736 bit
|
37748736 bit
|
| Memory Width |
36
|
36
|
| Number of Terminals |
72
|
72
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1MX36
|
1MX36
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SIMM
|
|
| Package Equivalence Code |
SSIM72
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
1024
|
|
| Seated Height-Max |
25.4 mm
|
|
| Standby Current-Max |
0.009 A
|
|
| Supply Current-Max |
0.81 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SIMM
|
| Pin Count |
|
72
|
| Access Mode |
|
FAST PAGE
|
| Memory IC Type |
|
FAST PAGE DRAM MODULE
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
|
|
|
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