MSC1175M
vs
MS2267
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROWAVE SEMICONDUCTOR CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Package Description |
|
0.400 X 0.400 INCH, HERMETIC SEALED, M214, 2 PIN
|
| Pin Count |
|
2
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Case Connection |
|
BASE
|
| Collector Current-Max (IC) |
|
20 A
|
| Configuration |
|
SINGLE
|
| DC Current Gain-Min (hFE) |
|
10
|
| Highest Frequency Band |
|
L BAND
|
| JESD-30 Code |
|
S-CDFM-F2
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
250 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLANGE MOUNT
|
| Polarity/Channel Type |
|
NPN
|
| Power Dissipation-Max (Abs) |
|
575 W
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
|
|
|
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