MSAST32MSB7226MPNB25 vs CGA6P3X7R1E226M250AE feature comparison

MSAST32MSB7226MPNB25 TAIYO YUDEN

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CGA6P3X7R1E226M250AE TDK Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TAIYO YUDEN CO LTD TDK CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 11 Weeks 32 Weeks, 4 Days
Samacsys Manufacturer TAIYO YUDEN
Capacitance 22 µF 22 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 2.5 mm 2.5 mm
JESD-609 Code e3 e3
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 20% 20%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, Embossed, 7 Inch TR, 7 INCH
Positive Tolerance 20% 20%
Rated (DC) Voltage (URdc) 25 V 25 V
Size Code 1210 1210
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Width 2.5 mm 2.5 mm
Base Number Matches 1 1
Reference Standard AEC-Q200

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