MS82000RKX-10
vs
EDI8F82048C100BSC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
WHITE ELECTRONIC DESIGNS CORP
Package Description
,
SIP-36
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
100 ns
100 ns
JESD-30 Code
R-XSMA-T36
R-XSMA-T36
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
36
36
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX8
2MX8
Output Enable
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
SIP36
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.21 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MS82000RKX-10 with alternatives
Compare EDI8F82048C100BSC with alternatives