MS1N5305
vs
JANS1N5305-1
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
COMPENSATED DEVICES INC
|
Package Description |
O-LALF-W2
|
HERMETIC SEALED PACKAGE-2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-7
|
DO-7
|
JESD-30 Code |
O-LALF-W2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
|
Knee Impedance-Max |
61000 Ω
|
|
Limiting Voltage-Max |
1.85 V
|
1.85 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.475 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulation Current-Nom (Ireg) |
2 mA
|
2 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
8
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Reference Standard |
|
MIL-19500/463G
|
|
|
|
Compare MS1N5305 with alternatives