MRF9045LSR1
vs
MRF9045MBR1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
FLATPACK, R-CDFP-F2
FLANGE MOUNT, R-PDFM-F2
Pin Count
2
2
Manufacturer Package Code
CASE 360C-05
CASE 1337-03
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Additional Feature
HIGH EFFICIENCY
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
65 V
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-CDFP-F2
R-PDFM-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
200 °C
175 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
175 W
177 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
4
4
Rohs Code
Part Package Code
TO-272
HTS Code
8541.29.00.75
JEDEC-95 Code
TO-272
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
40
Compare MRF9045LSR1 with alternatives
Compare MRF9045MBR1 with alternatives