MRF9045
vs
MRFE6S8046NR1
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
FLANGE MOUNT, R-CDFM-F2
|
,
|
Pin Count |
3
|
|
Manufacturer Package Code |
CASE 360B-05
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
SOURCE
|
|
Configuration |
SINGLE
|
|
DS Breakdown Voltage-Min |
65 V
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
|
JESD-30 Code |
R-CDFM-F2
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Mode |
ENHANCEMENT MODE
|
|
Operating Temperature-Max |
200 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLANGE MOUNT
|
|
Polarity/Channel Type |
N-CHANNEL
|
|
Power Dissipation-Max (Abs) |
125 W
|
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
|
Terminal Form |
FLAT
|
|
Terminal Position |
DUAL
|
|
Transistor Application |
AMPLIFIER
|
|
Transistor Element Material |
SILICON
|
|
Base Number Matches |
8
|
1
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MRF9045 with alternatives
Compare MRFE6S8046NR1 with alternatives