MRF8S9260HR3
vs
MRFE6S9125NBR1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
FLANGE MOUNT, R-CDFM-F2
|
FLANGE MOUNT, R-PDFM-F4
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.75
|
8541.29.00.75
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TO-272
|
| Pin Count |
|
4
|
| Samacsys Manufacturer |
|
NXP
|
| Case Connection |
|
SOURCE
|
| Configuration |
|
SINGLE
|
| DS Breakdown Voltage-Min |
|
66 V
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| Highest Frequency Band |
|
ULTRA HIGH FREQUENCY BAND
|
| JEDEC-95 Code |
|
TO-272
|
| JESD-30 Code |
|
R-PDFM-F4
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
4
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
225 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare MRF8S9260HR3 with alternatives
Compare MRFE6S9125NBR1 with alternatives