MRF8S19140HSR3
vs
MD7P19130HR3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
FLATPACK, R-CDFP-F2
FLANGE MOUNT, R-CDFM-F4
Reach Compliance Code
unknown
unknown
ECCN Code
5A991
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Base Number Matches
3
3
Pin Count
4
Manufacturer Package Code
CASE 465M-01
Case Connection
SOURCE
Configuration
COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
S BAND
JESD-30 Code
R-CDFM-F4
Number of Elements
2
Number of Terminals
4
Operating Mode
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
FLANGE MOUNT
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
N-CHANNEL
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Form
FLAT
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
Compare MRF8S19140HSR3 with alternatives
Compare MD7P19130HR3 with alternatives