MRF7S21210HSR3
vs
MRF6S18060NBR1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Package Description
FLATPACK, R-CDFP-F2
,
Pin Count
2
Manufacturer Package Code
CASE 465A-06
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Case Connection
SOURCE
Configuration
SINGLE
DS Breakdown Voltage-Min
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
S BAND
JESD-30 Code
R-CDFP-F2
Number of Elements
1
Number of Terminals
2
Operating Mode
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
FLATPACK
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Form
FLAT
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Transistor Application
AMPLIFIER
Transistor Element Material
SILICON
Base Number Matches
1
1
JESD-609 Code
e3
Moisture Sensitivity Level
3
Terminal Finish
MATTE TIN
Compare MRF7S21210HSR3 with alternatives
Compare MRF6S18060NBR1 with alternatives