MRF5S19060NR1
vs
MRF8S21140HSR3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
,
|
FLATPACK, R-CDFP-F2
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
4 Weeks
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
MATTE TIN
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Base Number Matches |
5
|
2
|
| Pbfree Code |
|
Yes
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
CASE 465A-06
|
| HTS Code |
|
8541.29.00.75
|
| Case Connection |
|
SOURCE
|
| Configuration |
|
SINGLE
|
| DS Breakdown Voltage-Min |
|
65 V
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| Highest Frequency Band |
|
S BAND
|
| JESD-30 Code |
|
R-CDFP-F2
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
225 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare MRF5S19060NR1 with alternatives
Compare MRF8S21140HSR3 with alternatives